Sep 18, 2020
There are also certain difficulties in applying ultrafast lasers for self-aggregation. For example, a Gaussian beam is used to self-focus to form a filament, with a length of at most one or two hundred microns, and the filament strength and thickness are uneven, with one end thick and one end thin. This will not ensure the stability of filament formation when the laser is applied to the material.
This difficulty is solved by spatially distributed beam shaping. The Gaussian beam that was originally focused at one point is transformed into a linear focused beam along the axis, which has a good focusing effect in a long range. The infrared laser uses a special operating mode to shape the pulse in time. The joint action of the two beam shaping achieves the maximization of the self-focusing effect.
Infrared picosecond laser
After shaping, the length of the filament can be within 5mm, and the thickness is uniform, suitable for glass cutting and drilling. Due to the large filament length, it can completely cover the thickness of the thin glass used in mobile phones, and the entire cutting profile can be modified with only one scan. Depending on different curves, the speed of laser cutting can range from tens of millimeters per second to one meter per second, and the cutting speed is more than tens of times that of traditional laser ablation.
The brittle material laser cutting module is matched with a picosecond laser, which can cut and drill with almost no taper, and can cut any shape to meet the various processing needs of special-shaped full screens. There are many types of glass that can be processed, and tempered glass that was considered impossible to be processed in the past can also be processed. Some processing cases are as follows:
Camera cover glass T0.55 mm
Corning Glass T3 mm
Matte glass T2 mm
Sapphire T0.3 mm
Full-screen TFT glass T0.25 mm (double layer)